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TSMC to push silicon boundaries with 3D ‘stacking’ tech, dubbed as “SoIC”, partners with AMD and Google
TSMC to push silicon boundaries with 3D ‘stacking’ tech, dubbed as “SoIC”, partners with AMD and Google
TSMC is drawing attention to the growing importance of chip packaging, a little-known part of the process of making semiconductors.
Nov. 28, 2020